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Kaynes: Kaynes Technology to invest Rs 2,800 crore in semiconductor packaging facility in Telangana

HYDERABAD: Mumbai-based integrated electronics manufacturer Kaynes Technology is investing Rs 2,800 crore in setting up a semiconductor OSAT (outsourced semiconductor assembly and test) manufacturing and compound semiconductor facility in Telangana.
The facility, which will create over 2,000 direct jobs, will come up on a 40-acre parcel of land adjacent to Taiwanese electronics contract manufacturing giant Foxconn’s upcoming facility at Kongara Kalan in Ranga Reddy district.
This facility will be set up by Kaynes Semicon, a subsidiary set up by Kaynes Technology for its foray into OSAT/ATMP (assembly, testing, marking and packaging) services.
Apart from this facility in Telangana, Kaynes Semicon is also setting up a R&D centre for package research in collaboration with IIT Bombay.
Kaynes Semicon will support its global customers in QFN (quad flat no-lead), SOT (smart outline transistor), TO, BGA (ball grid array), FC BGA (flip chip plastic BGA) type of packages for power devices in the first three years.
The announcement was made by Telangana industries & IT minister KT Rama Rao after he met the company’s founders here on Friday. KTR held a meeting with Kaynes Technology chairperson Savitha Ramesh and managing director Ramesh Kannan.
Speaking on the occasion, KTR said Telangana is emerging as a destination of choice for the semiconductor industry thanks to the availability of a skilled talent pool, rich R&D ecosystem, supporting infrastructure and proactive governance.
“The proposed investment by Kaynes will be a strategic investment that will further reinforce Telangana’s position as an ideal destination for hosting the semiconductor ecosystem,” he said.
While Kannan lauded the Telangana government’s unmatched speed of decision making and working, Ramesh said the proposed facility will be a state-of-the-art one.

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